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Wafer Cutting Machine
NCS, BBD, leakage detection那算 module, high-power spindle, high-spe城區ed and high-precision motor, auto來低matic alignment,靜工 automatic knife mark 河資recognition, scratch siz看年e detection, a varie相男ty of cutting modes, data manageme章機nt, log management system
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For Wafer
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NCS, BBD, leakage detectio明冷n module, high-pow慢文er spindle, high-s可睡peed and high-precision moto呢生r, automatic ali雨為gnment, automatic knife mar商年k recognition, scr湖去atch size detection, a va舊吧riety of cutting modes, data manageme話區nt, log management system
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